Wireless headset having improved rf immunity to rf electromagnetic interference produced from a mobile wireless communications device

ABSTRACT

A wireless headset has improved immunity to RF electromagnetic interference produced from wireless communications devices. A headset body is adapted to be worn by a user and includes a microphone and earpiece. An antenna receives wireless communication signals and passes them to RF and audio circuitry mounted within the headset body. The RF and audio circuitry include a Bluetooth module operatively connected to the antenna for transmitting and receiving wireless communication signals, an audio CODEC connected to the Bluetooth module, and audio connection lines connected between the CODEC and the earpiece and between the CODEC and the microphone. A filter is connected into each of the audio connection lines at the earpiece and microphone and operative for reducing the RF coupling from a mobile wireless communications device.

FIELD OF THE INVENTION

This invention relates to wireless headsets, and more particularly, thisinvention relates to wireless headsets that incorporate a Bluetoothmodule.

BACKGROUND OF THE INVENTION

Wireless headsets that incorporate a Bluetooth module to enable itswireless communications are becoming more commonplace and areadvantageous because Bluetooth eliminates the connection of wiresassociated with most consumer computer equipment and allows a collectionof products to function as an intelligent whole. It also makes locationconnectivity seamless. A Bluetooth system or module typically includes aradio, a baseband controller, a link manager, a logical link control, anadaptation protocol manager, host controller interface and applicationprogram interface library.

One common application of a Bluetooth module is with a headset forcellular or other mobile wireless communications devices. A wireless,Bluetooth headset would not require connecting wires between any mobiledevice and the headset. A drawback of this wireless or Bluetoothheadset, however, concerns the RF interference that occurs from a mobilewireless communications device to the wireless headset. Thisinterference can cause unwanted audible noise, such as Global System forMobile communications (GSM) buzz, which can be annoying to users.

BRIEF DESCRIPTION OF THE DRAWINGS

Other objects, features and advantages of the present invention willbecome apparent from the detailed description of the invention whichfollows, when considered in light of the accompanying drawings in which:

FIG. 1 is a perspective view of a wireless “Bluetooth” headset that canincorporate an RF filter to reduce RF coupling from a mobile wirelesscommunications device, in accordance with one non-limiting example.

FIG. 2 is a block diagram showing basic functional components of awireless or Bluetooth headset that could be adapted to incorporate an RFfilter to decrease unwanted audible noise, such as GSM buzz.

FIG. 3 is a schematic circuit diagram showing a combination earpiece andfilter circuit, which could be incorporated into the earpiece shown inFIG. 2.

FIG. 4 is a schematic circuit diagram showing a combination microphoneand filter circuit, which could be incorporated into the microphoneshown in FIG. 2.

FIG. 5 is a high-level block diagram of a Bluetooth module that could beused in the wireless headset shown in FIG. 2.

FIG. 6 is a high-level block diagram of an audio CODEC that could beused in the wireless headset shown in FIG. 2.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Different embodiments will now be described more fully hereinafter withreference to the accompanying drawings, in which preferred embodimentsare shown. Many different forms can be set forth and describedembodiments should not be construed as limited to the embodiments setforth herein. Rather, these embodiments are provided so that thisdisclosure will be thorough and complete, and will fully convey thescope to those skilled in the art. Like numbers refer to like elementsthroughout, and prime notation is used to indicate similar elements inalternative embodiments.

In accordance with one non-limiting embodiment, RF filters and RFshielding can be implemented and applied to a microphone circuit andspeaker circuit in a wireless “Bluetooth” headset. These types offilters and shielding can also be applied to a power supply circuit andother circuits to reduce the RF coupling from the wirelesscommunications device to those circuits used in the Bluetooth headset,which causes the audible unwanted noise, such as GSM buzz.

A wireless headset has improved immunity to RF electromagneticinterference produced from wireless communication devices, for example,a cellular phone. A headset body is adapted to be worn by a user andincludes a microphone carried by the headset body for receiving voicesignals from the user and an earpiece carried by the headset body fordirecting voice signals into an ear canal of the user. RF and audiocircuitry are mounted within the headset body and connected to anantenna for receiving and transmitting wireless communications signals.The RF and audio circuitry include a Bluetooth module operativelyconnected to the antenna and an audio CODEC connected to the Bluetoothmodule. Audio connection lines are connected between the CODEC and theearpiece and between the CODEC and the microphone. A filter is connectedinto each of the audio connection lines at the earpiece and microphoneand operative for reducing the RF coupling from a wirelesscommunications device.

In yet another non-limiting example, a filter is serially connected intoeach audio connection line and can be formed as a ferrite inductor,including a ferrite bead. The filter can also be formed as an LC filterserially connected into an audio connection line. In another aspect, aseries connected inductor and capacitor can be connected into an audioconnection line connected to the earpiece. The inductor could be formedas a ferrite inductor and an RF shield could surround one of at leastthe earpiece or microphone to aid in reducing the RF coupling from amobile wireless communications device. This RF shield could be formed asa metallic housing.

In yet another aspect, microphone bias lines connect the CODEC andmicrophone for passing microphone bias control signals between the CODECand the microphone. A microphone bias filter, in one non-limitingaspect, would be operative with the microphone bias lines for reducingthe RF coupling from a wireless communications device. The microphonebias filter could be formed as a serial inductor, shunt capacitor, orferrite bead. It can also be formed as a ground connected capacitor. Amethod aspect is also set forth.

FIG. 1 is a perspective view of a wireless or Bluetooth headsetillustrated generally at 10, which includes a headset body 10 a that isadapted to be worn by a user at the ear of the user, and a pivoting,C-shaped earmount 10 b that wraps around the ear. When wrapped aroundthe ear, an earpiece (not shown) carried by the headset body is engagedagainst the ear and directs voice signals into the ear canal of theuser. A pivoting microphone arm 10 c supports a microphone that receivesvoice signals from the user. The illustrated wireless headset has nowires and can interact wirelessly with different Bluetooth compliantdevices, for example, handsets, FDA's and computers. The pivotingmicrophone arm 10 c and earmount 10 b are foldable such that whenunfolded, the headset 10 is activated, allowing ready connection intoreceived or placed calls. The entire headset body 10 a can be worn overeither ear of a user. A volume control (not shown) would typicallyremain in an upward position when it is worn.

FIG. 2 is a high-level block diagram of the wireless Bluetooth headset11, which includes a microphone 12 and earpiece 14. The microphone 12 isconnected by dual input or audio connection lines Vin_P and Vin_Nthrough a low pass filter 16 to an audio CODEC (COder-DECoder) 18, whichconverts the analog signals to and from a digital data stream. Afeedback loop 20 extends between the audio CODEC 18 and the microphone12, and includes a bias line (MIC_BIAS) and voltage line (MIC_VSUP)extending to the microphone 12, forming microphone bias lines to allowmicrophone bias control signals to pass from the CODEC to themicrophone. A mute switch 22 is connected into the two lines. The audioCODEC 18 also connects to an audio amplifier circuit 24, which includesa volume control 26 connected in parallel. The audio amplifier 24 passesan analog output signal to the earpiece 14 through Vout_P and Vout_Nsignal or audio connection lines extending between the CODEC andearpiece. A built-in antenna 30 receives RF signals and passes them intoan RF filter 32, which filters the RF signals. The filtered signals arereceived in a Bluetooth module 34, which is connected to a rechargeablebattery 36 operative with a battery charge controller 38 and chargerinput 40. The Bluetooth module 34 is operatively connected to the audioCODEC 18. These components as illustrated and described could be formedon a circuit board or other support and mounted within the headset body10 a. The different audio connection lines could be formed as signal orcircuit traces or other means as known to those skilled in the art.

FIGS. 3 and 4 illustrate the type of Radio Frequency (RF)electromagnetic interference (EMI) filters that can be used for themicrophone 12 (FIG. 4) and the earpiece 14 (FIG. 3).

FIG. 3 shows a filter for the earphone illustrating the Vout_P andVout_N signal or audio connection lines. Each line includes an inductorelement I1, I2 and series connected capacitor elements C1, C2. Twoparallel capacitors C3 and C4 are connected as illustrated. Theinductors in each line can be formed as ferrite inductors, including aferrite bead.

As shown in FIGS. 2 and 4, the microphone 12 includes an output into thelow pass filter 16 as Vin_P, Vin_N audio connection lines. A capacitorC1, C2 and an inductor I1, I2 as an inductive coil are connected intoeach Vin_P and Vin_N line. Capacitors C3, C4 are connected parallel intothe Vin_P and Vin_N lines and positioned on either side of capacitorsC1, C2 and inductors I1, I2 as illustrated. The feedback circuit 20 fromaudio CODEC 18 control includes two signal or microphone bias lines,MIC_VSUP and MIC_BIAS, and each line includes an inductive coil 13, 14and grounded capacitor C5, C6, followed by another ground connectedcapacitor C7, C8 mounted parallel and connected into each line as thesignal enters the microphone as illustrated.

The RF filters as described could be RF ferrite beads, seriallyconnected inductors, or shunt capacitors or a combination of both. Inanother aspect, an isolation RF shield as a metallic formed enclosure or“can” could surround and isolate the microphone or earpiece transducerfrom radiating energy depending on the design. The solid line 12 a, 14 ain FIGS. 3 and 4 represents the “can” that could be used.

Different types, sizes and shapes of ferrite beads can be used.Typically, a ferrite bead is formed from a material having apermeability controlled by the composition of the different oxides, forexample, a ferric oxide, sometimes with nickel and zinc added. Theferrite beads can sometimes be formed as ferrite sleeves with two halfparts that are added onto a signal line or a solder overcoat on a signaltrace. Typically, the longer the bead, the better the RF suppression.The bead equivalent circuit can be a series resistor and inductor.

Many of the components as described can be formed as an integratedcircuit and contained within the headset body. The components can bemounted on a dielectric substrate, i.e., a circuit board. A circuitboard could refer to any dielectric substrate, PCB, ceramic substrate orother circuit carrying structures for carrying signal circuits inelectronic components. The battery 36 would typically be included withinany headset housing for the Bluetooth headset. Ferrite beads or similarinductor components can also be used with modifications.

It should be understood that the RF and EMI filters as describedrelative to FIGS. 2-4 can be used in many different types of Bluetoothheadsets. Typically, a Bluetooth headset includes a Bluetooth module andis operative as a wireless technology standard for connecting devices toreplace cables. It typically operates in radio frequencies in the 2.5GHz air interface and can transmit short distances of about 10 meters orless as a class 2 device. Usually, a Bluetooth system has a bandwidth ofabout one megabyte per second (1 MBPS) with individual packets of up to2,745 bits. A class 1 Bluetooth device could have a signal strength upto about 100 milliwatts for a range of about 100 meters in certainapplications.

Usually three basic components are incorporated in a Bluetooth module,including a processor, a baseband link controller that manages coreBluetooth processes, and a radio that implements the 2.5 GHz airinterface.

The Bluetooth architecture typically includes an application programinterface (API) libraries that are software modules that connect to hostapplication programs to a Bluetooth communication system. The logicallink control and adaptation protocol manages high level aspects of eachconnection, including encryption. It can convert the format of databetween application program interfaces and lower level Bluetoothprotocols. The link manager can manage physical details for Bluetoothconnections. The baseband is a digital engine of a Bluetooth system. TheBluetooth radio converts digital baseband data to an from the 2.4 GHzanalog signal typically using Gaussian frequency shift keying (GFSK)modulation.

FIG. 5 is a block diagram of a typical Bluetooth module 100 that can beused with the different embodiments of a Bluetooth headset. Asillustrated, a receive/transmit (Rx/Tx) switch 102 receives signals froman antenna 104 (which could correspond to antenna 30 described relativeto FIG. 2) and is operative with a Bluetooth transceiver 106, operativewith Bluetooth components that receive clock signals and are operativewith a CODEC interface and Host interface. These functional componentsinclude a Bluetooth baseband circuit 110, peripherals circuit 112, ROM114 and RAM 116, a RISC processor 118 and clock and power managementcircuit 120. Of course, many other components could be used as known toand suggested by those skilled in the art. An example of such afunctional Bluetooth module is a BRF 6100/6150 Bluetooth modulemanufactured by Texas Instruments.

Different types of CODEC's can also be used in the circuit shown in FIG.2, and an example CODEC is shown in FIG. 6 at 200, and could be used ina Bluetooth headset and operative with the Bluetooth module. Forexample, as illustrated, the CODEC could include an analog input into aS/H (Sample/Hold) amplifier 202 that passes to a successiveapproximations companding analog-to-digital converter (ADC) 204. A shiftregister 206 receives the signal from the successive approximationscompanding ADC 204 and produces a serial digital data output. A clocksignal is applied to the shift register 206 and also applied to a secondshift register 210 that sends data to a companding digital-to-analogconverter (DAC) 212 that transmits the converted signal through a bufferamplifier 214 as an analog output. Serial digital data input is receivedin the second shift register. N-bit parallel data pass betweencomponents as illustrated.

The CODEC could include a transmit functional component that includes ananalog input, amplifier, filters, sample and hold circuit comparator,successive approximation circuit, and an output register with feedbackand control logic. The CODEC could also include a receive function thatincludes an input register, digital-to-analog converter (DAC), receivecontrol logic that inputs into a sample and hold (S/H) circuit, which isbuffered and filtered using an adder and gain set logic. General controllogic could be operative with the digital-to-analog converter andreceive control logic. The sample and hold circuit could receive areference.

It should also be understood that the CODEC can use delta modulation tominimize the effects of noise without increasing the number of bitsbeing transmitted. Adaptive delta modulation could also be used, whichaids in overcoming the slope overload problem by varying the step sizesuch that the quantized signal more closely follows the original signal.

Many modifications and other embodiments of the invention will come tothe mind of one skilled in the art having the benefit of the teachingspresented in the foregoing descriptions and the associated drawings.Therefore, it is understood that the invention is not to be limited tothe specific embodiments disclosed, and that modifications andembodiments are intended to be included within the scope of the appendedclaims.

1-24. (canceled)
 25. A wireless headset comprising: a headset body; amicrophone carried by said headset body; an earpiece carried by theheadset body; and wireless and audio circuitry carried by said headsetbody and comprising circuit board traces defining respective audioconnection lines to said earpiece and said microphone, and a respectivefilter coupled to each of said audio connection lines, each filtercomprising a ferrite body on a respective circuit board trace.
 26. Thewireless headset according to claim 25 wherein each ferrite bodycomprises a ferrite bead.
 27. The wireless headset according to claim 25wherein each filter comprises at least one capacitor coupled to therespective circuit board trace.
 28. The wireless headset according toclaim 25 further comprising an antenna carried by said headset body andcoupled to said wireless and audio circuitry.
 29. The wireless headsetaccording to claim 25 wherein said wireless and audio circuitrycomprises Bluetooth circuitry and an audio CODEC coupled thereto. 30.The wireless headset according to claim 25 further comprising an RFisolation shield surrounding said earpiece.
 31. The wireless headsetaccording to claim 25 further comprising an RF isolation shieldsurrounding said microphone.
 32. The wireless headset according to claim25 wherein said headset body includes a pivoting microphone arm thatsupports said microphone.
 33. A wireless headset comprising: a headsetbody; a microphone carried by said headset body; an earpiece carried bythe headset body; and wireless and audio circuitry carried by saidheadset body and comprising circuit board traces defining respectiveaudio connection lines to said earpiece and said microphone, and arespective filter coupled to each of said audio connection lines, eachfilter comprising a ferrite bead on a respective circuit board trace andat least one capacitor coupled to the respective circuit board trace.34. The wireless headset according to claim 33 further comprising anantenna carried by said headset body and coupled to said wireless andaudio circuitry.
 35. The wireless headset according to claim 33 whereinsaid wireless and audio circuitry comprises Bluetooth circuitry and anaudio CODEC coupled thereto.
 36. The wireless headset according to claim33 further comprising an RF isolation shield surrounding said earpiece.37. The wireless headset according to claim 33 further comprising an RFisolation shield surrounding said microphone.
 38. The wireless headsetaccording to claim 33 wherein said headset body includes a pivotingmicrophone arm that supports said microphone.
 39. A method for making awireless headset comprising a headset body, a microphone carried by theheadset body, an earpiece carried by the headset body, and wireless andaudio circuitry carried by the headset body, the method comprising:forming the wireless and audio circuitry to include circuit board tracesdefining respective audio connection lines to the earpiece and themicrophone; and forming a respective filter coupled to each of the audioconnection lines, each filter comprising a ferrite body on a respectivecircuit board trace.
 40. The method according to claim 39 wherein eachferrite body comprises a ferrite bead.
 41. The method according to claim39 wherein forming each filter comprises forming each filter to includeat least one capacitor coupled to the respective circuit board trace.42. The method according to claim 39 further comprising coupling anantenna carried by the headset body to the wireless and audio circuitry.43. The method according to claim 39 wherein the wireless and audiocircuitry comprises Bluetooth circuitry and an audio CODEC coupledthereto.
 44. The method according to claim 39 further comprisingpositioning an RF isolation shield surrounding the earpiece.
 45. Themethod according to claim 39 further comprising positioning an RFisolation shield surrounding the microphone.
 46. The method according toclaim 39 wherein the headset body includes a pivoting microphone armthat supports the microphone.